Dr. Tresky AG designs and supplies manual and semi‑automatic die‑bonder systems for research, development and small‑volume production in microelectronics. The company offers modular platforms and process applications such as flip‑chip, sintering, thermocompression and RFID.
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Industry:Mechanical Engineering Industry
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Manual die bonder platforms for research, development and prototyping; flexible, precise systems for a wide range of applications and intuitive operation.
Semi-automatic die bonder
Semi-automatic die bonder platforms for research, development and small series; precise systems with efficient automation, reproducible results and process reliability.
Online product demonstration
Virtual machine demonstrations in the showroom for Tresky chip bonding solutions; appointments by phone or e-mail.
Applications for die bonder systems
Applications for Flip-Chip, RFID, Copper Pillar, Thermosonic Flip-Chip and Sinter; for precise processes in research, development and production.
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