Tresky RD GmbH develops precise manual and semi-automatic die bonder systems for research, development, and small-series production. The company provides modular solutions for micro-assembly and semiconductor applications.
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Semi-automatic die bonders for research, development and small series; T-5300, T-5300-W and T-5500 with motorized Z-axis, optional XY stage, image recognition and traceability.
Manual die bonder
Manual die bonders for research, development and small series; T-4909-AE, T-5100 and T-5100-W for flexible micromounting, prototyping and diverse bonding tasks.
Tools
Standard and customer-specific pick-up tools as well as ejection needles and dossier needles for manual and semi-automatic chip-assembly processes.
Custom solutions
Individually tailored end-to-end solutions for customer requirements; development with a modern development lab, analysis methods and experienced technical staff.
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