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DirectoryIndustryElectrical IndustryHünenbergQuasys AG
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Quasys AG

Summary

About the company

The core activity of Quasys is the development, manufacture and distribution of specialized solutions for the microelectronics, semiconductor and SMT/EMS industries. This includes in particular: The manufacture of feeder systems, such as JEDEC Tray and Waffle Pack Feeders; The development and manufacture of test sockets and bond tools; The distribution and technical support of products such as die bonders, sorters, plasma systems, test handlers and ovens. Quasys thus offers a wide range of solutions for back-end processes in the semiconductor industry and supports customers in the manufacture and testing of electronic components.

AI-generated
Offering

Products & services

Industry:Electrical Industry
✓ Offered8
Feeder
Tray conveyor modules for components in pallets to or from a process; JEDEC and random-access variants, waffle-pack feeders, Open Conveyor and custom adaptations.
Test socket
Test sockets and contact solutions for semiconductor testing; standard, prebuilt and custom test fixtures, contact pins, special connectors and cleaning products.
Bonding tools
Bonding tools, hold-downs, shear tools, ejector needles, wire hooks, rubber tips, as well as carriers and magazines, including custom versions.
DIE bonder (Tresky Automation)
Fully automatic DIE bonders for prototype and series production, with modular platforms, high precision and active-alignment solutions for photonics and advanced packaging.
Wire bonder (Hesse Mechatronics)
Ultrasonic wire bonders for thin and thick wire as well as flip-chip bonder systems, from manual to fully automatic setups with matching automation solutions.
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Location

Rothusstrasse 5A
6331 Hünenberg

At a glance

Legal form
Corporation
UID
CHE-106.431.161
Founded
1989 · 37 years
Last commercial register change
April 13, 2021
Employees
11 to 20

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