The core activity of Hybrid SA is the development and manufacturing of high-tech electronic products, particularly in the field of microelectronics. The company offers specific services such as die bonding, flip-chip, glob top, gold bumping, screen printing, SMT, testing and wire bonding. It specializes in the production of precision microelectronics for the watch industry and other areas requiring highly precise electronic components.
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Offering
Products & services
Industry:Manufacture of IT Hardware
✓ Offered10
Microelectronics assembly
Assembly and micro-assembly of electronic components for prototypes and series production, including customer-specific processes and various joining techniques.
SMT
Surface-mounting of electronic components on single- or double-sided substrates, including for very small components, from prototypes to more than 100'000 units.
Die bonding
Chip bonding on different substrates with defined placement accuracy, wafer mapping, various adhesives and packaging types.
Wire bonding
Wire bonding of bare chips using gold and aluminium wire, for complex and high-density bonding layouts as well as prototypes and series production.
Glob Top
Encapsulation and protection of microelectronic modules with epoxy, UV, silicone, underfill or potting compounds, manual or automatic.
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